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    Your Position: Home > ODM&OEM TEC > Multi-stage TEC
    Multi-stage TEC
    Multi-stage TEC
    Multi-stage TEC
    Multi-stage TEC

    Multi-stage TEC

    Application: Medical Equipment, Automotive, Communication And Other Industries
    Type: CXTech Offers Customized Thermal Solutions
    Size: 30*30*3.40mm
    Introduction
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    Features
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    Multi-stage TEC

    With over 20 years of manufacturing expertise, CXTech specializes in providing ODM and OEM thermoelectric cooler (TEC) solutions. Equipped with an in-house R&D department, we offer customized designs tailored to your unique requirements. Including developing multi-stage TECs, heterotype TECs, and TECs in various sizes and cooling capacities to meet diverse application needs. Let us bring your thermal management ideas to life with our advanced customization services.

    Multi-stage TEC
    Multi-stage TEC Specifications
    TEC model Imax (A) △Tmax (°C) Vmax(V) (Qc=0w) Qcmax(W) (△T=0℃)
    TEC2-19908 8 60 24.13 111.44

     

     Note*: ODM & OEM services are available. Only a select few models are displayed, please contact us directly for customized solutions.

    Dimensions(mm)
    Length Width Thickness
    30 30 3.40

     

    Remarks*: Size, coding, and wire length can be customized.

    Features

    Multi-Stage TEC:
    Multi-stage thermoelectric coolers are designed to achieve extremely low temperatures by stacking multiple TEC layers. This structure enhances the temperature differential, making them ideal for applications requiring precise cooling at sub-zero temperatures, such as infrared detectors, medical imaging, and laboratory equipment. They deliver efficient performance in compact designs while maintaining reliable thermal stability.
    Heterotype TEC:
    Heterotype thermoelectric coolers feature non-standard shapes, including circular, triangular, or custom geometries, tailored to fit unique device requirements. These TECs are widely used in specialized equipment, such as laser diodes, optical communication systems, and unique thermal management challenges. Their flexible designs ensure precise integration and optimized performance in non-conventional applications.